MBD110DWT1G, MBD330DWT1G
http://onsemi.com
5
PACKAGE DIMENSIONS
SC?88 / SC?70 / SOT?363
CASE 419B?02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B?01 OBSOLETE, NEW STANDARD 419B?02.
MME
0.2 (0.008)
123
D
e
A1
A
A3
C
L
654
?E?
b
6 PL
DIM MIN NOM MAX
MILLIMETERS
A
0.80 0.95 1.10
A1
0.00 0.05 0.10
A3
b
0.10 0.21 0.30
C
0.10 0.14 0.25
D
1.80 2.00 2.20
0.031 0.037 0.043
0.000 0.002 0.004
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.20 REF
0.008 REF
HE
HE
E
1.15 1.25 1.35
e
0.65 BSC
L
0.10 0.20 0.30
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
SCALE 20:1
mm
inches
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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MBD110DWT1/D
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